Numerical Study Using CFD on Heat Sinks for Electronic Components

Authors

DOI:

https://doi.org/10.29019/enfoqueute.1130

Keywords:

Heat sink, CFD, temperature, heat transfer

Abstract

In the present study, a numerical investigation is carried out using ANSYS CFD to observe the heat transfer and heat dissipation, the method is by forced convection heat transfer, with a modern and innovative heat sink. In the study, a configuration of six vertical central fins of equal size and three small fins horizontally is observed. With the lower surface heated, this simulates the heat rejection of electronic devices such as video cards in CPUs. The Navier-Stokes equations for fluid dynamics and the Kappa-Epsilon turbulence model based on RNG (Renormalization) are established for this study. The temperature in the air surrounding the heat sink increases by 0.62 to 0.79 °C, for the base temperature of 80 °C and 100 °C, respectively. This means that at a higher air flow speed, 20 m/s, the air has the capacity to heat up more since its heat exchange is stronger, therefore, the heat sink reduces its temperature.

heated, this simulates the heat rejection of electronic devices such as video cards in CPUs. The Navier-Stokes equations for
fluid dynamics and the Kappa-Epsilon turbulence model based on RNG (Renormalization) are established for this study. The
temperature in the air surrounding the heat sink increases by 0.62 to 0.79 °C, for the base temperature of 80°C and 100°C, respectively. This means that at a higher air flow speed, 20 m/s, the air has the capacity to heat up more since its heat exchange is stronger, therefore, the heat sink reduces its temperature.

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References

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Published

2025-04-01

How to Cite

Toapanta-Ramos, F., Espin, J., & Diaz, W. (2025). Numerical Study Using CFD on Heat Sinks for Electronic Components. Enfoque UTE, 16(2), 41–48. https://doi.org/10.29019/enfoqueute.1130

Issue

Vol. 16 No. 2 (2025)

Section

Miscellaneous

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